Assembler

As a Microelectronic Assembler I, you will learn and perform a variety of electronic assembly operations. The bulk of these duties will be performing manual wire bonding and or die attach operations on state-of-the-art electronic assemblies and subassemblies for the Department of War. The devices we create are designed to save American lives on the battlefield and to give our troops a technological advantage over our advisories. Learn the skills needed to accurately and efficiently build these devices as an associate so that you can advance in your career at Mercury, while earning a competitive salary and great benefits.

This is a 2 nd shift position 2:00pm to 11:30pm on a 9/80 schedule. Training is 3rd shift 9:00pm to 6:30am

Job Responsibility:

You will be responsible for learning how to and become proficient in die attach and wire bonding die level components from work instructions and assembly drawings. You will understand how to manipulate items using a variety of tools. Maintaining logs, paperwork, and forms with accuracy is imperative. Additionally, once trained, you will operate and troubleshoot production line equipment and computers to ensure smooth and accurate operation. Excellence will come with continuously meeting/exceeding production schedules and deadlines according to quality standards. You will be expected to self-monitor your workmanship and understand and follow all safety requirements, as well as ISO practices and procedures. Perform other duties as assigned

Required Qualification:

• Typically requires 0-1 year of experience in mechanical assembly


• Must be able to work 2 nd shift hours 2:00pm to 11:30pm


• Ability to perform detailed work under a microscope for long periods of time


• Can follow detailed written and verbal instructions in English


• Good problem solving skills


• Enthusiastic, cooperative, and positive behavior

Preferred Qualification:

• Microelectronics Assembly skills, including the ability to recognize non-conformities


• Knowledge of FOD and/or ESD


• Schooling or experience with die attach, wire bonding, PCB population, epoxy or other micro-electronic assembly


• Experience with Hybond or Westbond or equivalent wire bonders


• Experience with 0.7 and 0.8 mil gold wire and 2-3 gold mil ribbon bonds


• Experience with Substrate and Die attach with Silver Epoxy


• Ability to multi-task and work in a flexible and changing environment with multiple competing deadlines

This position requires you to access information that is subject to U.S. export regulations. You may only access such information if you are a U.S. citizen, lawful permanent resident of the U.S., protected individual as defined by 8 U.S.C. 1324b(a)(3), or eligible to obtain the required authorizations from the U.S. government.